AS300 Series

The AS300 series NVMe Heat Sink Ball Grid Array (HSBGA) SSDs are designed for space-constrained embedded and industrial applications operating in -40°C to +85°C. They feature an ultra-compact M.2 1620 form factor and 291-ball packaging. With PCIe Gen 4×4 and NVMe 1.4 interfaces, these SSDs deliver exceptional performance – up to 5,000 MB/s sequential read and 1,600 MB/s sequential write speeds. Product Specs and Datasheet →

PCIe 4.0 NVMe 1.4


291-ball BGA


-40˚C to +85˚C

Operating Temp

Up to

1 TB


Up to

0 GB/s

Sequential performance

High-Performance NVMe BGA SSD for Industrial Applications​

Optimized Thermal Management

Exascend's proprietary algorithm, Adaptive Thermal Control™, ensures sustained peak performance while effectively regulating the drive's temperature within specified thresholds. By combining adaptive hardware power reduction and intelligent SSD performance management, our SSDs maintain optimal functionality even in challenging thermal environments.

DRAM-Less with Host Memory Buffer (HMB) Support

Benefit from Host Memory Buffer (HMB) support in our DRAM-less SSDs, enhancing performance by utilizing DRAM resources as cache. This innovative approach mitigates the storage's limited memory capacity, optimizing I/O performance without necessitating onboard DRAM.

Optimized Power Consumption

With an exceptionally low power consumption of just less than 3.5W in active mode, the AS300 SSDs deliver significant power savings without compromising performance.

Rugged BGA Design

Engineered with a robust soldered BGA design, our SSDs endure rigorous vibration and shock, ensuring unwavering reliability in the harshest industrial environments.

Featured Storage Technologies


Optimized Thermal and Write Performance

Leveraging Exascend's Adaptive Thermal Control™ and SuperCruise™ technologies, the AS300 SSD optimizes performance through intelligent thermal management and write endurance algorithms. This ensures sustainable peak performance across diverse environments.


Error Correction

By employing LDPC ECC and firmware read disturb protection, Exascend's e.MMC can achieve high levels of data integrity, ensuring that the data remains intact and reliable even in the presence of errors.


Wide Temperature

Exascend’s wide temperature technology leverages a unique combination of high-quality components, purpose-designed hardware and highly-optimized firmware to deliver unmatched wide temperature performance and stability.

Product Information

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