The AS300 series NVMe Heat Sink Ball Grid Array (HSBGA) SSDs are designed for space-constrained embedded and industrial applications operating in -40°C to +85°C. They feature an ultra-compact M.2 1620 form factor and 291-ball packaging. With PCIe Gen 4×4 and NVMe 1.4 interfaces, these SSDs deliver exceptional performance – up to 5,000 MB/s sequential read and 1,600 MB/s sequential write speeds. Product Specs and Datasheet →
Interface
Package
Operating Temp
Up to
Capacity
Up to
Sequential performance
Exascend's proprietary algorithm, Adaptive Thermal Control™, ensures sustained peak performance while effectively regulating the drive's temperature within specified thresholds. By combining adaptive hardware power reduction and intelligent SSD performance management, our SSDs maintain optimal functionality even in challenging thermal environments.
Benefit from Host Memory Buffer (HMB) support in our DRAM-less SSDs, enhancing performance by utilizing DRAM resources as cache. This innovative approach mitigates the storage's limited memory capacity, optimizing I/O performance without necessitating onboard DRAM.
With an exceptionally low power consumption of just less than 3.5W in active mode, the AS300 SSDs deliver significant power savings without compromising performance.
Engineered with a robust soldered BGA design, our SSDs endure rigorous vibration and shock, ensuring unwavering reliability in the harshest industrial environments.
Leveraging Exascend's Adaptive Thermal Control™ and SuperCruise™ technologies, the AS300 SSD optimizes performance through intelligent thermal management and write endurance algorithms. This ensures sustainable peak performance across diverse environments.
By employing LDPC ECC and firmware read disturb protection, Exascend's BGA SSD can achieve high levels of data integrity, ensuring that the data remains intact and reliable even in the presence of errors.
Exascend’s wide temperature technology leverages a unique combination of high-quality components, purpose-designed hardware and highly-optimized firmware to deliver unmatched wide temperature performance and stability.
| Edition | AS300 Series |
| Interface | PCIe 4.0 / NVMe 1.4 |
| Flash type | 3D TLC |
| Form factor | 291 Ball. M.2 1620. |
| Capacity | 128GB to 1TB |
| Input voltage | PWR_1: 2.5V (2.35V~3.6V) PWR_2: 1.2V (1.14V~1.26V) PWR_3: 0.8V(0.76V~0.84V) |
| Power consumption | Active <3.5W; Idle <1W |
| Sequential read/write up to (HMB enabled) | 5,000/1,600 MB/s |
| 4K random read/write up to (HMB enabled) | 380,000/180,000 IOPS |
| Operational temperature (Tcase) | -40°C to 85°C |
| Storage temperature | -50℃ to 95℃ |
| Humidity (non-condensing) | 5–95% (Operating) |
| Features | Advanced LDPC error correction. Wear leveling. Firmware power loss protection. TCG Opal 2.0 (optional). |
| TBW up to | 600TB |
| DWPD (3 years) | 0.6 @ JESD218 1.5 @ sequential write |
| MTBF | 2,000,000 hours |
| Warranty | 3 years |
Download Datasheet
| Model Name | Interface | Form factor | Flash type | Capacity (GB) | Max. seq. read (MB/s) | Max. seq. write (MB/s) | TBW (max.) | Inquiry |
|---|---|---|---|---|---|---|---|---|
| EXP4L30001TZBBGI00H | PCIe 4.0 (NVMe 1.4) | 291-ball BGA, M.2 (1620) | 3D TLC | 1024 | 5000 | 1600 | 600 | |
| EXP4L30512GZABGI00H | PCIe 4.0 (NVMe 1.4) | 291-ball BGA, M.2 (1620) | 3D TLC | 512 | 5000 | 800 | 300 | |
| EXP4L30256GZ9BGI00H | PCIe 4.0 (NVMe 1.4) | 291-ball BGA, M.2 (1620) | 3D TLC | 256 | 3500 | 400 | 150 | |
| EXP4L30128GZ8BGI00H | PCIe 4.0 (NVMe 1.4) | 291-ball BGA, M.2 (1620) | 3D TLC | 128 | 1800 | 200 | 75 |
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