Exascend’s e.MMC memory combines premium NAND flash in an industry-standard 153-ball FBGA package. With the JEDEC-compliant e.MMC 5.1 interface, our e.MMC incorporates advanced technologies such as LDPC-based ECC, wear levelling, IOPS optimization, Secure Erase, and more.
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e.MMC simplifies the design and validation process for non-volatile memory interfaces, which makes it easy to integrate into existing verticals and future flash devices.
The Exascend e.MMC memory features an extended operating temperature range from –25˚C to 85˚C, allowing it to withstand for rugged industrial environments.
e.MMC is a classic storage solution for industrial applications and consumer electronics alike. Its application can be seen in mobile phones, handheld PCs, navigational systems, and PDAs. Automobiles and Computer on Module (CoM) designs are also common uses for it.
Thanks to its small BGA package size and low-power characteristics, e.MMC is a reliable, cost-effective memory solution for systems with limited space.
The e.MMC specifications are managed by JEDEC, a global standard-setter in the microelectronics industry. Exascend designs its e.MMC memory to meet the latest industry specifications and beyond. Leveraging our unique performance and stability-enhancing technologies, Exascend’s take the e.MMC flash memory performance to the limit.
Product highlights:
To learn more about how the Exascend Industrial e.MMC memory can bring your demanding applications to the next level, please do not hesitate to send us a product inquiry and we will get back to you in no time.
Exascend e.MMC SSD is certified for full compatibility with leading-brand system platforms from manufacturers such as Allwinner, Amlogic, Intel, MediaTek, Qualcomm, RockChip and Spreadtrum. The e.MMC can work flawlessly with models such as the MediaTek MT8163 and MT6753 lines, the Qualcomm S801, as well as Intel‘s Cherry Trail, Apollo Lake and Celeron N4000 models.
For a full list of all the system platforms the Exascend e.MMC is certified to be compatible with, visit Compatibility.
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RAID ECC is an advanced Exascend technology that combines the power of RAID with NAND flash block granularity, allowing the storage device to rebuild even severely corrupted data.
The best way to purge data rapidly is the way that works in tandem with your applications and operating procedures. That is why Exascend offers fully customizable secure data sanitization that leaves no data behind.
Data Retention Plus™ dynamically refreshes data stored on the Exascend storage device based on usage patterns. This facilitates even drive wear leveling and strengthens data retention.
Triggered by the user using either firmware or hardware, write protection technology safeguards data stored on the flash storage device by setting it to read-only mode, thereby blocking the host device from deleting or making any changes to the data.
e.MMC leverages Exascend's mission critical-grade and enterprise-class technologies to deliver extreme reliability and unwavering performance.
Industrial applications demand unwavering performance in challenging environments.
Next-generation telecom requires ultra-fast storage devices that excel in any environment.
The edge puts storage devices up against severe environmental challenges and unique demands.
Shocks, vibrations, and extreme temperature fluctuations demand only the best from storage devices.
| Image | Model Name | Form factor | Capacity (GB) | Max. seq. read (MB/s) | Max. seq. write (MB/s) | Operational temperature | Inquiry |
|---|---|---|---|---|---|---|---|
| ESEMSA0128GYBG | 153-pin FBGA | 128 | 282 | 197 | Extended (-25–85°C) | |
| ESEMSA016GYBG | 153-pin FBGA | 16 | 290 | 195 | Extended (-25–85°C) | |
| ESEMSA004GQBG | 153-pin FBGA | 4 | 160 | 52 | Extended (-25–85°C) | |
| ESEMSA008GQBG | 153-pin FBGA | 8 | 250 | 115 | Extended (-25–85°C) | |
| ESEMSA032GYBG | 153-pin FBGA | 32 | 290 | 195 | Extended (-25–85°C) | |
| ESEMSA064GYBG | 153-pin FBGA | 64 | 295 | 190 | Extended (-25–85°C) |
| e.MMC | ||
| Edition | e.MMC | |
| Physical information | ||
| Form factor | e.MMC 5.1 | |
| Interface | 153-ball FBGA | |
| Capacity | 16–64GB | 4–8GB |
| Flash type | 3D TLC | MLC |
| Input voltage | 3.3V±5% | |
| Power consumption | Active <3.3W; Idle <1.8W | |
| Performance | ||
| Maximum sequential read (MB/s) | 295 | 250 |
| Maximum sequential write (MB/s) | 197 | 115 |
| Max. 4K random read (IOPS) | 8,200 | 3,900 |
| Max. 4K random write (IOPS) | 7,000 | 4,400 |
| Reliability/endurance | ||
| Operational temperature (°C) | -25–85 | |
| Storage temperature (°C) | -40–85 | |
| UBER | <1 sector per 10^17 bits read | |
| Warranty (years) | 5 | |
