PI3 Series

The PI3 series presents a PCIe 3.0 storage solution, incorporating 3D TLC NAND technology tailored for industrial applications. It offers flexible form factors including M.2 2280 and U.2. Storage capacities range from 240GB to an impressive 7.68TB. Product Specs and Datasheet →

PCIe 3.0
NVMe 1.2

Interface

3D TLC

Flash

-40°C to 85°C

Wide temperature

Up to

0 TB

Capacity

Up to

0 MB/s

Sustained performance

Rugged, Reliable and Customizable PCIe Gen3 SSD

Maximum Ruggedness

The PI3 series ensures durability in challenging conditions, withstanding extreme temperatures, vibrations, shocks, and environmental hazards.

High-Capacity Industrial-Grade SSDs

Excelling in strategic partnerships, chip design optimization, cutting-edge controllers, and efficient heat dissipation, our high-capacity SSDs provide exceptional performance, reliability, and longevity for extensive data processing and rigorous benchmarks.

Fully Customizable Flash Storage Solutions

By collaborating with top-tier NAND flash manufacturers and SSD controller creators, we have engineered a bespoke firmware architecture that seamlessly unites advanced hardware and innovative design. This empowers flash storage, providing tailored solutions for success.

Unleashing Industrial Performance with NVMe SSD

Series highlights:

  • High sustained PCIe Gen3 performance: Sequential read/write speeds up to 3100 MB/s and 1600 MB/s.
  • High-capacity configurations: Up to 3.84 TB for M.2 2280 and 7.68 TB for U.2 form factors.
  • Rugged design: Crafted for industrial environments, enduring temperatures from -40°C to 85°C.
  • Adaptive Thermal Control™ algorithm: Enables temperature monitoring and intelligent management.
  • Security at its core: TCG Opal 2.0 compliant with AES-256 encryption support; hardware secure erase and temper-proof firmware available.
  • Enhanced power efficiency: Ensures optimal performance for your industrial needs.

Product Specs and Datasheet →

Note: Promotional label not included with product. Actual product labeling may differ from marketing images.

Featured Storage Technologies

1

Wide Temperature

Exascend’s wide temperature technology leverages a unique combination of high-quality components, purpose-designed hardware and highly-optimized firmware to deliver unmatched wide temperature performance and stability.

12

Optimized Thermal and Write Performance

Our Adaptive Thermal Control™ technology enhances system thermals, airflow, and acoustics, reducing BOM costs. The SuperCruise™ algorithm optimizes write performance, boosting long-term stability and overall reliability.

7

Enhanced Power Efficiency

Our control in hardware, firmware and manufacturing allows unmatched power tuning services. Tailoring product performance for your applications achieves optimal performance-to-thermal and performance-to-power ratios.

17

Data Security and Encryption

TCG Opal 2.0-compliant, our self-encrypting drives (SEDs) support AES-256 encryption, BitLocker, and IEEE 1667. Customize with pre-boot authentication (PBA), data sanitization, and Tamper-Proof Firmware for enhanced security.

16

Uncompromised Data Integrity

Leveraging RAID5 at a flash memory block level, our unique RAID ECC recovers severely corrupted data. In sudden power loss, our hardware and firmware power loss protection (PLP) ensures data integrity.

Product Information

Scroll to Top

Exascend Newsletter

Subscribe to our newsletter to receive updates about products, services, events and resources you may find of interest.

Product Inquiry

Please ensure the email address you provide is accurate and valid. This is crucial for us to effectively communicate with you.

By clicking submit above, you consent to allow Exascend to store and process the personal information submitted above to provide you the content requested.

Download whitepaper