PCIe Gen4 x4

PR4 Series
Incorporates rad-hard technology, conformal coating, and underfill for radiation-intensive environments.
Interface
PCIe 4.0 / NVMe 1.4
Flash type
3D TLC
Form factor
M.2 2280, 2242
Capacity
480GB to 7.68TB
Sequential read
up to 3,230 (MB/s)
Sequential write
up to 2,910 (MB/s)
Power consumption
Active <8.2W; Idle <1.4W
Operational temperature
-40°C to 85°C
Hightlight feature
Radiation Hardened
Conformal Coating
Underfill
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PA4 Series
Includes conformal coating and underfill for harsh conditions.
Interface
PCIe 4.0 / NVMe 1.4
Flash type
3D TLC / pSLC
Form factor
M.2 2280, 2242, 2230
Capacity
240GB to 7.68TB
Sequential read
up to 3,230 (MB/s)
Sequential write
up to 3,000 (MB/s)
Power consumption
Active <8.2W; Idle <1.4W
Operational temperature
-40°C to 85°C
Hightlight feature
Conformal Coating
Underfill
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PI4 Series
Built to perform reliably in extreme temperature conditions.
Interface
PCIe 4.0 / NVMe 1.4
Flash type
3D TLC / pSLC
Form factor
M.2 2280, 2242, 2230
Capacity
240GB to 7.68TB
Sequential read
up to 3,230 (MB/s)
Sequential write
up to 3,000 (MB/s)
Power consumption
Active <8.2W; Idle <1.4W
Operational temperature
-40°C to 85°C
Hightlight feature
More detail

PE4 Series
Delivers sustained performance across varying DWPD / TBW.
Interface
PCIe 4.0 / NVMe 1.4
Flash type
3D TLC / pSLC
Form factor
M.2 2280, 2242, 2230
Capacity
240GB to 7.68TB
Sequential read
up to 3,270 (MB/s)
Sequential write
up to 3,005 (MB/s)
Power consumption
Active <7.2W; Idle <1.4W
Operational temperature
0°C to 70°C
Hightlight feature
More detail