BGA SSD

AEC-Q100 Grade 2 certified

Overview

Compact, Rugged, High-Performance BGA NVMe SSDs

Compact, Rugged BGA SSD Enable Board Mounting

With a wide operating temperature range of -40°C to 105°C and enhanced ruggedization, BGA design offers excellent resilience against shocks, vibrations, and extreme conditions. It features direct PCB mounting, removing connectors to save cost and space, ideal for compact applications. This design suits industrial, automotive, and demanding environments, ensuring high performance and reliability.

Optimized Thermal Management

Incorporate Adaptive Thermal Control technology to regulate temperature and power consumption by monitoring real-time conditions, fine-tuning performance to prevent overheating, and enhancing reliability and lifespan. A built-in heat sink on the BGA package aids in efficient thermal dissipation, ensuring consistent, reliable performance under demanding workloads.

Optimized Low Power Design

Low power design by integrating the controller and NAND into a single package, alongside optimized firmware tuning. This enhances energy efficiency, reduces power consumption, improves thermal management, and boosts device reliability. The reduced energy usage also contributes to eco-friendliness by minimizing the environmental impact.

Featured Technologies

Experience innovation with our products, crafted using cutting-edge technology to deliver unmatched performance and quality.

Specifications

Specifications

EM500 / EM300 / EM100
SeriesAS500AS300AS100
InterfacePCIe 4.0 / NVMe 1.4PCIe 4.0 / NVMe 1.4PCIe 4.0 / NVMe 1.4
Form factor291 Ball. M.2 1620.291 Ball. M.2 1620.291 Ball. M.2 1620.
Capacity128GB to 1TB128GB to 1TB128GB to 1TB
Flash type3D TLC3D TLC3D TLC
Max. sequential read (HMB enabled)up to 5,000 (MB/s)up to 5,000 (MB/s)up to 5,000 (MB/s)
Max. sequential write (HMB enabled)up to 1,600 (MB/s)up to 1,600 (MB/s)up to 1,600 (MB/s)
4K random read (HMB enabled)380,000 IOPS380,000 IOPS380,000 IOPS
4K random write (HMB enabled)180,000 IOPS180,000 IOPS180,000 IOPS
Input voltagePWR_1: 2.5V (2.35V~3.6V)
PWR_2: 1.2V (1.14V~1.26V)
PWR_3: 0.8V(0.76V~0.84V)
PWR_1: 2.5V (2.35V~3.6V)
PWR_2: 1.2V (1.14V~1.26V)
PWR_3: 0.8V(0.76V~0.84V)
PWR_1: 2.5V (2.35V~3.6V)
PWR_2: 1.2V (1.14V~1.26V)
PWR_3: 0.8V(0.76V~0.84V)
Active Mode (Avg.)Active < 3.5WActive < 3.5WActive < 3.5W
Idle mode (Avg.)Idle < 1WIdle < 1WIdle < 1W
Operational temperature-40°C to 105°C-40°C to 85°C0°C to 70°C
Storage temperature-50°C to115°C-50°C to 95°C-50°C to 95°C
Humidity (non-condensing)5–95% (Operating)5–95% (Operating)5–95% (Operating)
MTBF2,000,000 hours2,000,000 hours2,000,000 hours
TBW up to600TB600TB600TB
DWPD (JESD219 Enterprise)0.6 @ JESD218
1.5 @ sequential write
0.6 @ JESD218
1.5 @ sequential write
0.6 @ JESD218
1.5 @ sequential write
Warranty3 years3 years5 years
FeaturesAdvanced LDPC error correction.
Wear leveling.
Firmware power loss protection.
TCG Opal 2.0 (optional).
Advanced LDPC error correction.
Wear leveling.
Firmware power loss protection.
TCG Opal 2.0 (optional).
Advanced LDPC error correction.
Wear leveling.
Firmware power loss protection.
TCG Opal 2.0 (optional).

Inquiry

SeriesAS500AS300AS100
Capacity128GB/EXP4L30128GZ8BGT00H128GB/EXP4L30128GZ8BGI00H128GB/EXP4L20128GXFBGC00H
256GB/EXP4L30256GZ9BGT00H256GB/EXP4L30256GZ9BGI00H256GB/EXP4L20256GX2BGC00H
512GB/EXP4L30512GZABGT00H512GB/EXP4L30512GZABGI00H512GB/EXP4L20512GX3BGC00H
1TB/EXP4L30001TZBBGT00H1TB/EXP4L30001TZBBGI00H1TB/EXP4L20001TXUBGC00H

Resource

Resource

File(s)TypeDownload
High-Performance NVMe BGA SSDs for Extreme EnvironmentsPDF

Product Inquiry

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