Automotive
Driving Innovation in Automotive Storage
As automobiles become more technologically advanced, connected cars have become data centers on wheels, generating a vast amount of data captured by in-vehicle applications. This data provides advanced and personalized infotainment and ensures safer driving experiences. As a result, automobile Original Equipment Manufacturers (OEMs) and Tier 1 suppliers require high-performance, high-capacity, high-endurance, and reliable storage solutions.
Exascend is the leading provider of automotive-grade storage solutions, designed to address the challenges associated with automotive data storage. Our storage solutions support a range of automotive applications, including advanced driver assistance systems (ADAS), in-vehicle infotainment (IVI) systems, black box recorders, vehicle-to-everything (V2X) communications, and more. Our fully customizable solid-state drives (SSDs) and memory cards are built to withstand extreme temperatures, shock, vibration, and cyber threats, making them ideal for automotive use.
Featured Storage Technologies
Data Security and Encryption
Compliant with TCG Opal 2.0, our self-encrypting drives (SEDs) support AES-256 encryption, BitLocker and IEEE 1667 features, as well as pre-boot authentication (PBA). Custom data sanitization and Tamper-Proof Firmware encryption are available upon request to deliver enhanced protection against security challenges in the connected era.
Dual power loss protection (PLP)
In the event of a sudden power failure, our hardware and firmware power loss protection provides two invaluable extra lines of defense against data integrity issues. This guarantees that all in-flight data is safely stored before the controlled storage device shuts down.
Wide Temperature Ranges and Ruggedization
Exascend products are designed to operate in extreme temperatures ranging from -40°C to 85°C (with certain products reaching up to 105°C). Our Underfill and Conformal Coating technologies provide durability against humidity, vibrations, shocks and pressure, allowing us to tackle rigorous obstacles.
NVMe and SATA SSD in Various Form Factors
Our SSD portfolios encompass a wide array of options, featuring both NVMe and SATA interfaces, available in various form factors like M.2, 2.5-inch, EDSFF, and more. Additionally, for automotive applications and systems, we provide e.MMC, industrial-grade SD, microSD, and CFexpress solutions.
Thermal and Performance Optimization
Our proprietary Adaptive Thermal Control™ technology improves system thermals, airflow, and acoustics, reducing BOM cost. Additionally, our garbage collection technology, SuperCruise™, optimizes write performance, boosting long-term stability, and overall reliability.
IATF 16949 Certified
Exascend production line became officially IATF 16949:2016 certified in 2022, confirming full compliance with the rigorous automotive requirements and international standards.
Why We Are Different
Customization through Our Own Hardware and Firmware Design
Our complete control over our hardware and firmware solutions, combined with our commitment to customization, allows us to address customer pain points and solve unique challenges. From selecting the ideal materials to writing the firmware source code, we work closely with our customers to deliver tailored solutions that meet their specific needs.
In-House Product Design, Validation, Manufacturing and Testing Capabilities
Our ISO9001-certified quality management system (QMS) includes product traceability and 100% mass production (MP) testing before shipment, ensuring our products meet the highest standards of quality and reliability. As a result, we have been a trusted supplier to some of the Fortune 500 companies for years.
Recommended Products
- e.MMC 5.1, 153-ball FBGA
- 176-layer 3D TLC NAND
- Up to 256 GB capacity
- Up to 295 MB/s performance
- Op. temp -40°C to 105°C
- Customizable firmware
- SD 6.0
- 176-layer 3D TLC NAND
- Up to 256 GB capacity
- Up to 90 MB/s performance
- Op. temp -40°C to 105°C
- V30/A2 speed class. IP67.
- SD 6.0
- 176-layer 3D TLC NAND
- Up to 256 GB capacity
- Up to 90 MB/s performance
- Op. temp -40°C to 85°C
- V30 speed class. IP67.
- PCIe 4.0 / NVMe 1.4
- 176-layer 3D TLC NAND
- Up to 7.68 TB capacity
- Up to 3,500 MB/s sustained performance
- Op. temp -40°C to 85°C
- Conformal Coating and Underfill featured
