AS500 BGA SSD

The AS500 series NVMe Heat Sink Ball Grid Array (HSBGA) SSDs are designed for seamless integration into space-constrained systems, featuring an ultra-compact M.2 Type 1620 form factor (16x20x1.65mm) and 291-ball packaging. With high-speed PCIe Gen 4×4 and NVMe 1.4 interfaces, these SSDs deliver exceptional performance, reaching up to 5,000 MB/s read and 1,600 MB/s write sequential speeds, and up to 380K IOPS read and 180K IOPS write random performance. (HMB On scenario)

Featured Storage Technologies

Adaptive Thermal Control™

Exascend's exclusive algorithm maintains optimal performance while keeping the drive's temperature within defined thresholds, combining adaptive hardware power reduction and intelligent precision SSD performance management.

Rugged BGA Design

Soldered BGA design withstands intense vibration and shaking, ensuring reliability in demanding environments.

DRAM-Less with HMB

HMB utilizes host memory as cache, boosting DRAM-less performance.

Power Efficiency

Precise tuning from hardware to firmware optimizes thermal and power profiles per application.

Wide Temperature Operation

Specialized components and firmware enable reliable operation from -40°C to 105°C, ideal for next-gen connected vehicles and harsh environments.

EditionAS500 Series
InterfacePCIe 4.0 / NVMe 1.4
Flash type3D TLC
Form factor291 Ball. M.2 Type 1620.
Capacity128GB to 1TB
Input voltagePWR_1: 2.5V (2.35V~3.6V)
PWR_2: 1.2V (1.14V~1.26V)
PWR_3: 0.8V(0.76V~0.84V)
Power consumptionActive <3.5W; Idle <1W
Sequential read/write up to5,000/1,600 MB/s
4K random read/write up to380,000/180,000 IOPS
Operational temperature (Tcase)-40°C to 105°C
Storage temperature-50℃ to 115℃
Humidity (non-condensing)5–95% (Operating)
FeaturesAdvanced LDPC error correction.
Wear leveling.
Firmware power loss protection.
TBW up to600TB
DWPD0.6 @ JESD218
1.5 @ sequential write
MTBF2,000,000 hours
Warranty3 years
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