AS500 Series

Engineered for automotive’s harshest conditions, the AS500 NVMe HSBGA SSDs deliver uncompromising reliability. Its soldered BGA withstands extreme shock, vibration, and temperatures, safeguarding data integrity. With built-in SR-IOV, it supports up to four virtual machines (VMs) via direct PCIe interfaces, maximizing performance. Optimized for space-constrained in-vehicle deployments, the AS500 combines exceptional endurance with virtualization capabilities, making it ideal for next-generation connected and autonomous vehicles. Product Specs and Datasheet →

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PCIe 4.0 NVMe 1.4

Interface

291-ball BGA

Package

AEC-Q100 Grade 2

Testing in progress

Up to

1 TB

Capacity

Up to

0 GB/s

Sequential performance

Purpose-Built for Connected and Autonomous Vehicles

Optimized Thermal Management

Exascend's proprietary algorithm, Adaptive Thermal Control™, ensures sustained peak performance while effectively regulating the drive's temperature within specified thresholds. By combining adaptive hardware power reduction and intelligent SSD performance management, our automotive-grade SSDs maintain optimal functionality even in challenging thermal environments.

DRAM-Less with Host Memory Buffer (HMB) Support

Benefit from Host Memory Buffer (HMB) support in our DRAM-less SSDs, enhancing performance by utilizing DRAM resources as cache. This innovative approach mitigates the storage's limited memory capacity, optimizing I/O performance without necessitating onboard DRAM.

Optimized Power Consumption

With an exceptionally low power consumption of just less than 3.5W in active mode, the AS500 SSDs deliver significant power savings without compromising performance.

Built-in Single Root-IO Virtualization (SR-IOV*)

The AS500 features built-in SR-IOV capabilities, enabling up to four direct, high-speed PCIe interfaces for virtualized environments. Each virtual machine (VM) connects via a dedicated virtual function (VF) in the SSD controller, eliminating hypervisor overhead for near-native performance. This innovative architecture delivers cost savings by consolidating multiple storage devices, low latency with flexible QoS, and reduced CPU utilization.

* SR-IOV will be enabled through future firmware updates upon successful validation and implementation.
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Reliable Wide-Temp BGA SSD with Rigorous QC Testing

Every Exascend microSD500 card undergoes a rigorous QC testing regimen during production, featuring an extensive wide-temperature burn-in test spanning from -40°C to 105°C.

Exascend AS500 BGA SSD undergoes a rigorous QC testing regimen during production, featuring an extensive wide-temperature burn-in test spanning from -40°C to 105°C. This testing surpasses commercial grade standards and guarantees that our wide temperature products will consistently operate reliably and perform optimally in extreme and rapidly fluctuating temperatures.

Featured Storage Technologies

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Optimized Thermal and Write Performance

Leveraging Exascend's Adaptive Thermal Control™ and SuperCruise™ technologies, the AS500 SSD optimizes performance through intelligent thermal management and write endurance algorithms. This ensures sustainable peak performance across diverse environments.

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Error Correction

By employing LDPC ECC and firmware read disturb protection, Exascend's e.MMC can achieve high levels of data integrity, ensuring that the data remains intact and reliable even in the presence of errors.

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Wide Temperature

Exascend’s wide temperature technology leverages a unique combination of high-quality components, purpose-designed hardware and highly-optimized firmware to deliver unmatched wide temperature performance and stability.

Recommended Applications

Automotive

Aerospace and Mission Critical

Transportation

Industrial

Edge Computing and IoT

Product Information

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