Edge computing
Experience cutting-edge computing everywhere
IoT. Intelligence. Convenience. Smart Devices.
With edge computing, processing power comes closer to where it is needed the most. But the edge is challenging. Exposed to the elements and often located in places hard to reach, edge devices require efficiency, ruggedness and power.
Are your devices ready for life on the edge?
Intelligent edge. Rugged edge.
The era of edge computing is upon us. According to research by Gartner, 75 percent of data will be processed outside traditional centralized data centers and the cloud by 2025.
This represents a paradigm shift for computing as we know it. As more and more data get generated and processed in edge devices that also demands ever-smarter and more powerful hardware on the edge.
The rise of edge computing promises a smarter and more convenient life for consumers and a new era of innovation and increased efficiency for corporations. And while the benefits are many, the advent of edge computing also presents a monumental challenge: how do you build future-proof edge infrastructure that is up for the task today and will not incur unexpected costs in the future?
With so many devices across so many locations, it is paramount that devices not only provide enough performance to carry out their tasks but also that they are reliable, energy-efficient, and long-lasting. Otherwise, an investment in the future of edge computing can quickly turn into a costly venture with little upside.
Ensuring equipment and component toughness is especially important in rugged edge applications where edge devices are exposed to even harsher environments and challenges, for example in industrial settings or remote locations in harsh climates.
Key challenges
Limited space, unlimited power
Edge devices are often compact but require high-performing components to carry out their increasingly complex tasks.
Long-term economic feasibility
Edge infrastructure is built for the long haul, requiring devices to remain fully functional with minimal downtime to be a worthwhile investment.
Tough working environments
Often exposed to challenging outdoor conditions, tough industrial environments and remote settings, edge devices must be engineered with ruggedness as a priority.
Our solutions
Compact and competent
We offer exceptional performance across form factors of all sizes, including customized form factors for particularly compact or unique edge systems.
Reliable hardware and stable performance
Our hardware is engineered to last and our firmware is designed to provide applications with a consistently high level of performance.
Rugged to the core
Our rugged storage devices are designed from the ground up to withstand severe environmental challenges and mechanical stress – ideal for the rugged edge.
Recommended technologies
Adaptive Thermal Control™
Our unique Adaptive Thermal Control™ technology tackles the issue of overheating and thermal throttling that is unavoidable in high-performance PCIe NVMe flash storage devices.
Wide Temperature
Exascend’s wide temperature technology leverages a unique combination of high-quality components, purpose-designed hardware and highly-optimized firmware to deliver unmatched wide temperature performance and stability.
Dual Power Loss Protection
In the event of sudden loss of power, our hardware and firmware power loss protection provide two invaluable extra lines of defense against data integrity issues, guaranteeing that all in-flight data is safely stored before controlled storage device shutdown.
Power Tuning
Our unique level of control over hardware, firmware and manufacturing enables us to provide unmatched tuning services. By tuning the performance of our product specifically for your applications, we can achieve the highest possible performance to thermals and performance to power ratios.
Firmware Integrity Plus™
Exascend’s Firmware Integrity Plus™ eliminates the risk that firmware corruption renders the flash storage completely inoperable by keeping multiple firmware backups ready for deployment at a moment’s notice.
Recommended products
- PCIe 4.0 (NVMe 1.4) interface
- 3D TLC NAND flash
- Up to 8 TB capacity
- 3,500 MB/s sustained read
- 3,000 MB/s sustained write
- PCIe 3.0 (NVMe 1.2) interface
- 3D TLC NAND flash
- Up to 16 TB capacity
- 3,500 MB/s sustained read
- 3,500 MB/s sustained write
- SATA-III interface
- 3D TLC NAND flash
- Up to 8 TB capacity
- 550 MB/s sustained read
- 535 MB/s sustained write
- JEDEC e.MMC 5.1 interface
- Up to 64 GB capacity
- Extended temp. (-25–85°C)
- 295 MB/s sustained read
- 195 MB/s sustained write
- SD 3.0 form factor
- 3D TLC NAND flash
- Wide temperature (-40–85°C)
- Up to 256 GB capacity
- 80 MB/s maximum write
- SD 3.0 form factor
- 3D TLC NAND flash
- Wide temperature (-40–85°C)
- Up to 256 GB capacity
- 80 MB/s maximum write
