The EM100 series e.MMC is purpose-built for consumer electronics and select industrial applications, providing optimal performance within a temperature range of -25˚C to 85˚C. It boasts premium NAND flash memory in a standard 153-ball FBGA package with the JEDEC e.MMC 5.1 interface and HS400 DDR mode, making it an ideal choice for data-intensive workloads. Product Specs and Datasheet →
Specifications
Package
Op. temp
Up to
Capacity
Up to
Sustained performance
The EM100 is certified for seamless compatibility with a wide range of leading-brand system platforms and models such as MediaTek MT8163, MT6753, Qualcomm S801, and Intel's Cherry Trail, Apollo Lake, and Celeron N4000. List of compatible platforms →
The Exascend EM100 series features an extended operating temperature range (-25˚C to 85˚C), making it suitable for both embedded applications like point of sales (PoS) systems, smart home appliances, set-top boxes (STBs), gaming consoles, and mobile devices such as smartphones, tablets, wearables, and more.
Our e.MMC incorporates advanced technologies such as LDPC-based ECC, power loss protection, wear levelling, IOPS optimization, read disturb, Secure Erase, Write Protection, and more.
Exascend’s EM100 series e.MMC is purpose-built to meet the demands of embedded applications and mobile devices such as smartphones, set-top boxes (STBs), gaming consoles, PoS systems, and more.
Key features:
Exascend's power loss protection enables the flash storage device to quickly rebuild the mapping table when power is restored, ensuring seamless card functionality for the application.
By employing LDPC ECC and firmware read disturb protection, Exascend's e.MMC can achieve high levels of data integrity, ensuring that the data remains intact and reliable even in the presence of errors.
Exascend offers Secure Erase feature to guarantee swift and completely secure data deletion. Simultaneously, the Write Protection technology safeguards data stored on the flash storage device by configuring it into a read-only mode, effectively preventing the host device from altering or deleting any data.
| Edition | EM100 | |
| Interface / Data transfer mode | e.MMC 5.1 / HS400 DDR mode | |
| Package | 153-ball FBGA | |
| Capacity | 16 GB to 128GB | 4 GB / 8 GB |
| Flash type | 3D TLC | MLC |
| Sequential read/write up to | 295/197 MB/s | 250/115 MB/s |
| 4K random read/write up to | 8,200/7,100 IOPS | 4,200/4,400 IOPS |
| Input voltage | 3.3V±5% | |
| Power consumption | Active <3.3W; Idle <1.8W | |
| Operational temperature | -25°C to 85°C | |
| Storage temperature | -40°C to 85°C | |
| Features | LDPC ECC. Firmware power loss protection. Firmware read disturb. Secure Erase. Write Protection. |
|
| TBW (max.) | 305 | 23 |
| DWPD (max.) JESD218 | 1.3 | 1.5 |
| Warranty | 3 years | |
Download Datasheet
| Image | Model Name | Form factor | Capacity (GB) | Max. seq. read (MB/s) | Max. seq. write (MB/s) | Operational temperature | Inquiry |
|---|---|---|---|---|---|---|---|
 | ESEMSA128GYBG | 153-pin FBGA | 128 | 282 | 197 | Extended (-25–85°C) | |
 | ESEMSA016GYBG | 153-pin FBGA | 16 | 290 | 195 | Extended (-25–85°C) | |
 | ESEMSA004GQBG | 153-pin FBGA | 4 | 160 | 52 | Extended (-25–85°C) | |
 | ESEMSA008GQBG | 153-pin FBGA | 8 | 250 | 115 | Extended (-25–85°C) | |
 | ESEMSA032GYBG | 153-pin FBGA | 32 | 290 | 195 | Extended (-25–85°C) | |
 | ESEMSA064GYBG | 153-pin FBGA | 64 | 295 | 190 | Extended (-25–85°C) |
The EM100 is certified for compatibility with the following system platforms:
| Manufacturer | Model |
|---|---|
| Allwinner | A20 / A33 / H6 |
| Amlogic | S805 / S905X / S905X2 / S905X3 / S905W |
| Intel | Cherry Trail / Apollo Lake / Celeron N4000 |
| MTK | MT8163 / MT8167 / MT8168 / MT8173 / MT8735 / MT8735B / MT8735M / MT8765 / MT8766 / MT8783 / MT8788 / MT8937 / MT6580 / MT6735 / MT6737 / MT6739 / MT6753 / MT6761 / MT6763 |
| Qualcomm | S801 |
| RockChip | RK3126 / RK3288 / RK3318 / RK3326 / RK3399 |
| Spreadtrum | SC7731E / SC9832 / SC9863 |
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