The EM300 series e.MMC is purpose-built for industrial applications, providing optimal performance within a temperature range of -40˚C to 85˚C. It boasts premium NAND flash memory in a standard 153-ball FBGA package with the JEDEC e.MMC 5.1 interface and HS400 DDR mode, making it an ideal choice for data-intensive workloads. Product Specs and Datasheet →
Specifications
Package
Operating Temp
Up to
Capacity
Up to
Sequential performance
The EM300 is certified for seamless compatibility with a wide range of leading-brand system platforms and models such as MediaTek MT8163, MT6753, Qualcomm S801, and Intel's Cherry Trail, Apollo Lake, and Celeron N4000. List of compatible platforms →
With its wide operating temperature range spanning from -40˚C to 85˚C, the EM300 series is tailor-made for a variety of industrial applications such as IoT gateways, embedded PCs, factory automation, drones, and more.
Our e.MMC incorporates advanced technologies such as LDPC-based ECC, power loss protection, wear levelling, IOPS optimization, read disturb protection, secure erase, write protection, and more.
Series highlights:
Exascend's power loss protection enables the flash storage device to quickly rebuild the mapping table when power is restored, ensuring seamless card functionality for the application.
By employing LDPC ECC and firmware read disturb protection, Exascend's e.MMC can achieve high levels of data integrity, ensuring that the data remains intact and reliable even in the presence of errors.
Exascend offers Secure Erase feature to guarantee swift and completely secure data deletion. Simultaneously, the Write Protection technology safeguards data stored on the flash storage device by configuring it into a read-only mode, effectively preventing the host device from altering or deleting any data.
| Edition | EM300 Series | |
| Interface / Data transfer mode | e.MMC 5.1 / HS400 DDR mode | |
| Package | 153-ball FBGA | |
| Capacity | 16 GB to 128 GB | 4 GB / 8 GB |
| Flash type | 3D TLC | MLC |
| Sequential read/write up to | 295/197 MB/s | 250/115 MB/s |
| 4K random read/write | 8,200/7,100 IOPS | 4,200/4,400 IOPS |
| Input voltage | 2.7~3.6V | |
| Power consumption | Active <3.3W; Idle <1.8W | |
| Operational temperature | -40°C to 85°C | |
| Storage temperature | -50°C to 95°C | |
| Features | LDPC ECC. Firmware power loss protection. Firmware read disturb. Secure Erase. Write Protection. | |
| TBW (max.) | 305 | 23 |
| DWPD (JESD218) | 1.3 | 1.5 |
| Warranty | 3 years | |
Download Datasheet
| Model Name | Form factor | Flash type | Capacity (GB) | Max. seq. read (MB/s) | Max. seq. write (MB/s) | TBW (max.) | Inquiry |
|---|---|---|---|---|---|---|---|
| ESEMSA128GYBG-I | 153-pin FBGA | 3D TLC | 128 | 282 | 197 | 305 | |
| ESEMSA064GYBG-I | 153-pin FBGA | 3D TLC | 64 | 295 | 190 | 148 | |
| ESEMSA032GYBG-I | 153-pin FBGA | 3D TLC | 32 | 290 | 195 | 70 | |
| ESEMSA016GYBG-I | 153-pin FBGA | 3D TLC | 16 | 290 | 195 | 35 | |
| ESEMSA008GQBG-I | 153-pin FBGA | MLC | 8 | 250 | 115 | 23 | |
| ESEMSA004GQBG-I | 153-pin FBGA | MLC | 4 | 160 | 52 | 10.7 |
The EM300 is certified for compatibility with the following system platforms:
| Manufacturer | Model |
|---|---|
| Allwinner | A20 / A33 / H6 |
| Amlogic | S805 / S905X / S905X2 / S905X3 / S905W |
| Intel | Cherry Trail / Apollo Lake / Celeron N4000 |
| MTK | MT8163 / MT8167 / MT8168 / MT8173 / MT8735 / MT8735B / MT8735M / MT8765 / MT8766 / MT8783 / MT8788 / MT8937 / MT6580 / MT6735 / MT6737 / MT6739 / MT6753 / MT6761 / MT6763 |
| Qualcomm | S801 |
| RockChip | RK1808 / RK3126 / RK3228H / RK328X / RK3308 / RK3318 / RK3326 / RK3328 / RK3368 / RK3368H / RK3399 / RK3399PRO / RK3528 / RK3562 / RK3588 / RKPX30 / RKPX5 / RV1103 / RV1106 / RV1107 / RV1108 / RV1109 / RV1126 |
| Spreadtrum | SC7731E / SC9832 / SC9863 |
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