EM500 Series
The EM500 series is perfect for tough automotive needs, using 3D TLC NAND flash memory in a compact JEDEC e.MMC 5.1 compliant 153-ball FBGA package. It supports HS400 DDR mode for fast data transfer, operates in extreme temperatures (-40°C to 105°C), making it an ideal e.MMC choice for next-gen connected vehicles. Product Specs and Datasheet →

HS400
Specifications
Package
Testing in progress
Up to
Capacity
Up to
Sequential performance
Purpose-Built for Connected and Autonomous Vehicles
Withstands Extreme Temperatures
The EM500 operates in challenging automotive conditions, withstanding temperature extremes from -40°C to 105°C. It is optimized for automotive applications such as ADAS, infotainment, navigation systems, and high-definition mapping.
Rigorously Tested for Quality Assurance
The EM500 series adheres to the industrial quality standards. It follows the Production Part Approval Process (PPAP) and is manufactured on an IATF16949-certified production line. The EM500 is also undergoing AEC-Q100 Grade 2 qualification testing to ensure optimal reliability.
Customizable Firmware
Our engineering experts can customize the firmware to meet your application's specific requirements. We provide long-term support for lasting compatibility.
Compatible with Leading Platforms
The EM500 seamlessly integrates with major system platforms including MediaTek MT8163, MT6753, Qualcomm S801, Intel Cherry Trail, Apollo Lake, and Celeron N4000. List of compatible platforms →
Reliable e.MMC for Automotive Applications
Key features:
- Compliant with JEDEC e.MMC 5.1, backward compatible with v4.41/v4.5/v5.0
- High Speed 400 (HS400) DDR mode for fast transfer speeds
- Sequential read up to 295 MB/s, sequential write up to 210 MB/s
- Wide range of densities from 4 GB to 256 GB (4/8/16 GB in pSLC mode)
- Inclusive SMART health monitor software
- Advanced technologies: LDPC-based ECC, power loss protection, wear levelling, IOPS optimization, read disturb prevention, secure erase, write protection, and Field Firmware Update (FFU)


Reliable Wide-Temp e.MMC with Rigorous QC Testing
Exascend EM500 e.MMC undergoes a rigorous QC testing regimen during production, featuring an extensive wide-temperature burn-in test spanning from -40°C to 105°C. This testing surpasses commercial grade standards and guarantees that our wide temperature products will consistently operate reliably and perform optimally in extreme and rapidly fluctuating temperatures.
Featured Storage Technologies
Power Loss Protection
Exascend's power loss protection enables the flash storage device to quickly rebuild the mapping table when power is restored, ensuring seamless card functionality for the application.
Error Correction
By employing LDPC ECC and firmware read disturb protection, Exascend's e.MMC can achieve high levels of data integrity, ensuring that the data remains intact and reliable even in the presence of errors.
Data Security
Exascend offers Secure Erase feature to guarantee swift and completely secure data deletion. Simultaneously, the Write Protection technology safeguards data stored on the flash storage device by configuring it into a read-only mode, effectively preventing the host device from altering or deleting any data.
Recommended Applications
ADAS
Navigation system
Infotainment system
HD Mapping
Digital event recorders
Telematics system
Product Information
Edition | EM500 Series | |
Compliance | e.MMC 5.1 (backward compatible with v4.41/v4.5/v5.0) | |
Interface data transfer mode | HS400 DDR mode | |
Package | 153-ball FBGA | |
Flash type | 176-layer 3D TLC NAND | |
Capacity | pSLC: 4 GB to 16 GB | TLC: 32 GB to 256 GB |
Sequential read/write up to | 295/210 MB/s | |
4K random read/write up to | 8,400/6,000 IOPS | |
Input voltage | 3.3V±5% | |
Power consumption | Active <3.3W; Idle <1.8W | |
Operational temperature | -40°C to 105°C | |
Storage temperature | -50°C to 115°C | |
Features | LDPC ECC. Firmware power loss protection. Firmware read disturb protection. Secure erase. Write protection. Field Firmware Update (FFU). | |
TBW up to | 382 TB | 614 TB |
DWPD up to | 26.6 | 2.33 |
Warranty | 3 years |
Download Datasheet
Image | Model Name | Form factor | Capacity (GB) | Max. seq. read (MB/s) | Max. seq. write (MB/s) | Operational temperature | Inquiry |
---|---|---|---|---|---|---|---|
![]() | ESEMSA256GYMG-T | 153-pin FBGA | 256 | 295 | 210 | Automotive (-40–105°C) | |
![]() | ESEMSA128GYMG-T | 153-pin FBGA | 128 | 295 | 210 | Automotive (-40–105°C) | |
![]() | ESEMSA064GYMG-T | 153-pin FBGA | 64 | 280 | 205 | Automotive (-40–105°C) | |
![]() | ESEMSA032GYMG-T | 153-pin FBGA | 32 | 280 | 205 | Automotive (-40–105°C) | |
![]() | ESEMSA016GPMG-T | 153-pin FBGA | 16 | 280 | 205 | Automotive (-40–105°C) | |
![]() | ESEMSA008GPMG-T | 153-pin FBGA | 8 | 280 | 205 | Automotive (-40–105°C) | |
![]() | ESEMSA004GPMG-T | 153-pin FBGA | 4 | 280 | 205 | Automotive (-40–105°C) |
The EM500 is certified for compatibility with the following system platforms:
Manufacturer | Model |
---|---|
Allwinner | A20 / A33 / H6 |
Amlogic | S805 / S905X / S905X2 / S905X3 / S905W |
Intel | Cherry Trail / Apollo Lake / Celeron N4000 |
MTK | MT8163 / MT8167 / MT8168 / MT8173 / MT8735 / MT8735B / MT8735M / MT8765 / MT8766 / MT8783 / MT8788 / MT8937 / MT6580 / MT6735 / MT6737 / MT6739 / MT6753 / MT6761 / MT6763 |
Qualcomm | S801 |
RockChip | RK3126 / RK3288 / RK3318 / RK3326 / RK3399 |
Spreadtrum | SC7731E / SC9832 / SC9863 |