EM500 Series

The EM500 series is perfect for tough automotive needs, using 3D TLC NAND flash memory in a compact JEDEC e.MMC 5.1 compliant 153-ball FBGA package. It supports HS400 DDR mode for fast data transfer, operates in extreme temperatures (-40°C to 105°C), making it an ideal e.MMC choice for next-gen connected vehicles. Product Specs and Datasheet →

e.MMC 5.1


153-ball FBGA


AEC-Q100 Grade 2

Testing in progress

Up to

0 GB


Up to

0 MB/s

Sequential performance

Purpose-Built for Connected and Autonomous Vehicles

Withstands Extreme Temperatures

The EM500 operates in challenging automotive conditions, withstanding temperature extremes from -40°C to 105°C. It is optimized for automotive applications such as ADAS, infotainment, navigation systems, and high-definition mapping.

Rigorously Tested for Quality Assurance

The EM500 series adheres to the industrial quality standards. It follows the Production Part Approval Process (PPAP) and is manufactured on an IATF16949-certified production line. The EM500 is also undergoing AEC-Q100 Grade 2 qualification testing to ensure optimal reliability.

Customizable Firmware

Our engineering experts can customize the firmware to meet your application's specific requirements. We provide long-term support for lasting compatibility.

Compatible with Leading Platforms

The EM500 seamlessly integrates with major system platforms including MediaTek MT8163, MT6753, Qualcomm S801, Intel Cherry Trail, Apollo Lake, and Celeron N4000. List of compatible platforms →

Reliable e.MMC for Automotive Applications

Key features:

  • Compliant with JEDEC e.MMC 5.1, backward compatible with v4.41/v4.5/v5.0 
  • High Speed 400 (HS400) DDR mode for fast transfer speeds 
  • Sequential read up to 295 MB/s, sequential write up to 210 MB/s 
  • Wide range of densities from 4 GB to 256 GB (4/8/16 GB in pSLC mode)
  • Inclusive SMART health monitor software 
  • Advanced technologies: LDPC-based ECC, power loss protection, wear levelling, IOPS optimization, read disturb prevention, secure erase, write protection, and Field Firmware Update (FFU)

Product Specs and Datasheet →

Reliable Wide-Temp e.MMC with Rigorous QC Testing

Exascend EM500 e.MMC undergoes a rigorous QC testing regimen during production, featuring an extensive wide-temperature burn-in test spanning from -40°C to 105°C. This testing surpasses commercial grade standards and guarantees that our wide temperature products will consistently operate reliably and perform optimally in extreme and rapidly fluctuating temperatures.

Featured Storage Technologies


Power Loss Protection

Exascend's power loss protection enables the flash storage device to quickly rebuild the mapping table when power is restored, ensuring seamless card functionality for the application.


Error Correction

By employing LDPC ECC and firmware read disturb protection, Exascend's e.MMC can achieve high levels of data integrity, ensuring that the data remains intact and reliable even in the presence of errors.


Data Security

Exascend offers Secure Erase feature to guarantee swift and completely secure data deletion. Simultaneously, the Write Protection technology safeguards data stored on the flash storage device by configuring it into a read-only mode, effectively preventing the host device from altering or deleting any data.

Recommended Applications


Navigation system

Infotainment system

HD Mapping

Digital event recorders

Telematics system

Product Information

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