The Exascend microSD500 series is specifically engineered for automotive and mission-critical applications that operate in extreme temperatures, ranging from -40°C to 105°C. This series utilizes 176-layer 3D TLC NAND flash and incorporates advanced firmware technologies such as LDPC ECC, wear leveling and pSLC, ensuring unwavering data integrity, high endurance and sustained performance. Product Specs and Datasheet →
Interface
NAND Flash
Wide temperature
Up to
Capacity
Up to
Performance
The microSD500 series boasts cutting-edge temperature tech, enduring temperatures of up to 105°C. It holds an IP67 rating for dust and water resistance and is also certified as X-ray safe.
We provide customers with steadfast Fixed BOM (Bill of Materials) solutions that ensure both product performance and long-term support.
Easily track and monitor the health of your Exascend microSD500 cards with our SMART Tool software with a GUI.
Key features:
Exascend microSD500 cards undergo a rigorous QC testing regimen during production, featuring an extensive wide-temperature burn-in test spanning from -40°C to 105°C. This testing surpasses commercial grade standards and guarantees that our wide temperature products will consistently operate reliably and perform optimally in extreme and rapidly fluctuating temperatures.
Exascend’s wide temperature technology leverages a unique combination of high-quality components, purpose-designed hardware and highly-optimized firmware to deliver unmatched wide temperature performance and stability.
Our pSLC technology leverages the advantages of SLC and contemporary 3D TLC flash to enhance sustained performance, reduce storage latency, and enhance endurance, particularly for 8GB and 16GB cards.
Exascend's firmware power loss protection enables the flash storage device to quickly rebuild the mapping table when power is restored, ensuring seamless card functionality for the application.
By employing LDPC ECC and firmware read disturb protection, Exascend's memory cards can achieve high levels of data integrity, ensuring that the data remains intact and reliable even in the presence of errors.
Exascend provides customizable secure data sanitization, offering various options such as normal erase and software-triggered erase. This ensures fast and fully secure data purging.
| Series | microSD500 |
| Interface | SD 3.0/6.0 microSDXC/microSDHC UHS-I |
| Dimensions | 11 mm (L) x 15 mm (W) x 2.1 mm (T) |
| Capacity | pSLC: 8 GB to 16 GB TLC: 32 GB to 256 GB |
| Flash type | 176-layer 3D TLC |
| Input voltage | 2.7 ~ 3.6V |
| Read/Write speed up to | 90/80 MB/s |
| Speed Class | C10 / U3 / V30 |
| Performance Class | A2 |
| Operational temperature | -40°C to 105°C |
| Storage temperature | -50°C to 115°C |
| Features | Built-in LDPC error correction Firmware power loss protection Firmware read disturb protection Secure erase |
| TBW up to | 610 TB |
| MTBF | 2,000,000 hours |
| Warranty | 3 years |
Download datasheet
| Image | Model Name | Flash type | Capacity (GB) | Max. seq. read (MB/s) | Max. seq. write (MB/s) | TBW (max.) | Inquiry |
|---|---|---|---|---|---|---|---|
| EX8GUSDV30-PTDE | 3D TLC, pSLC | 8 | 90 | 80 | 155 | |
| EX16GUSDV30-PTDE | 3D TLC, pSLC | 16 | 90 | 80 | 320 | |
| EX32GUSDV30-TDE | 3D TLC | 32 | 90 | 80 | 73 | |
| EX64GUSDV30-TDE | 3D TLC | 64 | 90 | 80 | 145 | |
| EX128GUSDV30-TDE | 3D TLC | 128 | 90 | 80 | 300 | |
| EX256GUSDV30-TDE | 3D TLC | 256 | 90 | 80 | 610 |
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