Managed NAND
Compact, Rugged, and Reliable Storage Solutions
Exascend provides customized NAND solutions, including eMMC and BGA SSDs, for automotive, industrial, and consumer applications with exacting standards. Designed to withstand intense vibration and shaking, our eMMC and BGA SSD solutions ensure reliability in demanding environments. They incorporate LDPC error correction, wear leveling, power loss protection, and security features, delivering durability, reliability, and robust data integrity across extreme temperatures from -40°C to 105°C. Meticulously engineered to optimize performance and compliance, our solutions address precise application demands.
e.MMC
- e.MMC v5.1. 153-ball FBGA.
- 3D TLC / pSLC
- pSLC: 4GB / 8GB / 16GB
TLC: 32GB to 256GB - Up to 295 MB/s sequential performance
- Op. temp -40℃ to 105℃
- Firmware customizable
- e.MMC v5.1. 153-ball FBGA.
- 3D TLC / MLC
- MLC: 4GB / 8GB
TLC: 16GB to 128GB - Up to 295 MB/s sequential performance
- Op. temp -40℃ to 85℃
- e.MMC v5.1. 153-ball FBGA.
- 3D TLC / MLC
- MLC: 4GB / 8GB
TLC: 16GB to 128GB - Up to 295 MB/s sequential performance
- Op. temp -25℃ to 85℃
BGA SSD
- PCIe Gen4 x4 / NVMe 1.4
- 291-ball BGA. M.2 1620.
- 3D TLC
- 128GB to 1TB
- Op. temp -40℃ to 105℃
- DRAM-less with HMB
- Built-in SR-IOV
- PCIe Gen4 x4 / NVMe 1.4
- 291-ball BGA. M.2 1620.
- 3D TLC
- 128GB to 1TB
- Op. temp -40℃ to 85℃
- DRAM-less with HMB
- PCIe Gen4 x4 / NVMe 1.4
- 291-ball BGA. M.2 1620.
- 3D TLC
- 128GB to 1TB
- Op. temp 0℃ to 70℃
- DRAM-less with HMB
