DDR4 UDIMM

Exascend’s blistering DDR4 UDIMMs deliver speeds of up to 3200 MT/s tailored for ADAS, telecom, networking, computing, and embedded systems requiring unmatched performance. These JEDEC-standard modules, available in 8GB, 16GB, and 32GB capacities, are engineered to meet the rigorous demands of industrial and embedded applications. Whether opting for the Wide-Temperature or Standard-Temperature version, our DDR4 UDIMMs guarantee reliability, compatibility, and durability in even the harshest operating environments. 

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Original wide-temp / Quality ICs

From major manufacturers

-40°C to 85°C
0°C to 70°C

Op. temperature

Up to

0 GB

Capacity

0 MT/s

Data rate

1.2V

JEDEC standard

Reliable DDR4 UDIMM Designed for Industrial and Embedded Applications

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Wide-Temp Edition

  • Original wide-temperature ICs from major memory manufacturers ensure compatibility, performance and reliability.
  • Rigorous testing and adherence to JEDEC standards ensure high-quality assurance.
  • 30μ” thick gold plated interfaces on the PCB significantly increase the plug/unplug service life.
  • Anti-sulfur protection guards against corrosion over time.
  • Combined with conformal coating and underfill options, this rigid plating durability enables reliable performance despite vibration, extreme temperatures, and humidity.

Product Specs and Datasheet →

Standard-Temp Edition

  • Quality ICs from major memory manufacturers ensure compatibility, performance and reliability.
  • Rigorous testing and adherence to JEDEC standards ensure high-quality assurance.
  • Enhanced with conformal coating and underfill options for increased durability, ensuring reliable performance despite vibration and humidity.

Product Specs and Datasheet →

Note: Promotional label not included with product. Actual product labeling may differ from marketing images.

Featured Storage Technologies

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Conformal Coating

Exascend employs conformal coating technology to apply a protective acrylic layer over DRAM modules, safeguarding against contaminants and moisture that could impact performance. This coating shields PCB and components from acids, particles, corrosion and extreme temperatures.

Underfill

Exascend utilizes underfill technology with epoxy bonding, securing integrated circuits to the PCB and minimizing BGA-related malfunctions. This creates a resilient connection, reducing susceptibility to factors like friction and shocks, while also inhibiting tin whisker formation.

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Wide Temperature Range of -40°C to 85°C

Exascend’s wide temperature technology leverages a unique combination of high-quality components, purpose-designed hardware and highly-optimized firmware to deliver unmatched wide temperature performance and stability.

Product Information

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Download DDR4 UDIMM
wide-temp datasheet

Download DDR4 UDIMM
standard-temp datasheet

Download whitepaper